RRP Electronics Limited and AMB, Taiwan, have signed a Memorandum of Understanding (MoU). Its collaboration’s plan is geared toward spearheading the innovation and manufacturing of modern memory modules, including SPI NAND, MICROSD, EMMC, and SSD. This sort of partnership can be considered as a turning point in the global semiconductor environment and is forecasted to generate US$ 25 million per year.
The agreement covers all aspects of technology sharing, such as substrate designs, test program creation, package structure details, and tool design support. The new memory solutions will meet the growing demand in the worldwide electronics market thanks to their increased capacities, which start at 2GB.
Strategic goals and expansion plans
Speaking to Rajendra Chodankar, the Chairman of RRP Electronics Limited, this partnership will help them set up advanced machineries at their OSAT facility and ensure that their products are ready to cater to big firms like Samsung and others. It also positions them as a global semiconductor innovator, and helps open up possibilities for earning US$ 25 million every year.
The production is planned to take place at the 40, 000 square feet OSAT building in Mahape which was set by RRP Electronics in September, 2024. To meet this demand, the company is also planning to incorporate new lines in its future factory at MIDC, Taloja which is expected to be operational within the time frame of the next two years.
